MH-781
TS-9870F
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Bonding material
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Detailed introduction
Parameters
Feature | High Thermal Conductivity |
Good Adhesion to metalized surface | |
Good workability, longer tack time | |
lOum BIT adjustable with Ag spacer |
Storage Condition | below -40℃in freezer | ||
Ag Content | 92 wt% | Calculatedafter 850 ℃firing | |
Viscosity | 18 Pa.s | E-type 3°corn,5rpm @ RT | |
Thixotropic Index | 6.5 | 0.5rpm/5rpm | |
Volume Resistivity | 5 x 10-6 Ω・cm | Resistivitymeter | |
DieShear Strength | at RT | 50 N/mm2 | 2x2mm Si-die (BSM:Ag) / Ag plated LF |
at 260℃ | 30 N/mm2 | ||
Thermal Conductivity | 160 W/mK | Measured by Laser flush |
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