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TS-1855

TS-1855
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Detailed introduction
Parameters
Feature High Thermal Conductivity
Good Adhesion to metalized surface
Good workability, longer tack time

 

 

Storage Condition below -40℃in freezer  
Ag Content 91 wt% Calculatedafter 850 ℃firing
Viscosity 18 Pa.s E-type 3°corn,5rpm @ RT
Thixotropic Index 6 0.5rpm/5rpm
Volume Resistivity 10.0 x 10-6 Ω・cm Resistivitymeter
DieShear Strength at RT 32 N/mm2 2x2mm Si-die (BSM:Ag) / Ag plated LF
at 260℃ 14 N/mm2
Elastic Modulus at RT 16,500 Mpa Measured by DMS
at 260℃ 3,600 MPa
Coefficientof Thermal Expansion α1 27 ppm/℃ Measured by TMA
α2 29 ppm/℃
Tg 75S℃
Thermal Conductivity 80 W/m・K Measured by Laser flush 

 

We could not find any corresponding parameters, please add them to the properties table

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