Polishing materials
TS-1855
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Product serial number
Category
Adhesive and Bonding material
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Detailed introduction
Parameters
| Feature | High Thermal Conductivity |
| Good Adhesion to metalized surface | |
| Good workability, longer tack time |
| Storage Condition | below -40℃in freezer | ||
| Ag Content | Calculatedafter 850 ℃firing | ||
| Viscosity | E-type 3°corn,5rpm @ RT | ||
| Thixotropic Index | 0.5rpm/5rpm | ||
| Volume Resistivity | Resistivitymeter | ||
| DieShear Strength | at RT | 2x2mm Si-die (BSM:Ag) / Ag plated LF | |
| at 260℃ | |||
| Elastic Modulus | at RT | Measured by DMS | |
| at 260℃ | |||
| Coefficientof Thermal Expansion | α1 | Measured by TMA | |
| α2 | |||
| Tg | |||
| Thermal Conductivity | Measured by Laser flush | ||
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