MH-781
TS-185-G1B
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Category
Bonding material
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Detailed introduction
Parameters
Feature | High Thermal Conductivity |
Good Adhesion to bare-Si & metalized | |
Good tack time |
Storage Condition | below -40℃in freezer | ||
Ag Content | 91 wt% | Calculatedafter 850 ℃firing | |
Viscosity | 20 Pa.s | E-type 3°corn,5rpm @ RT | |
Thixotropic Index | 6 | 0.5rpm/5rpm | |
Volume Resistivity | 20 x 10-6 Ω・cm | Resistivitymeter | |
DieShear Strength | at RT | 22 N/mm2 | 2x2mm Si-die (BSM:Ag) / Ag plated LF |
at 260℃ | 4.5 N/mm2 | ||
Elastic Modulus | at RT | 11,000 Mpa | Measured by DMS |
at 260℃ | 1,200 MPa | ||
Coefficientof Thermal Expansion | α1 | 30 ppm/℃ | Measured by TMA |
α2 | 46 ppm/℃ | ||
Tg | 75 | ||
Thermal Conductivity | 45 W/m・K | Measured by Laser flush |
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