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TS-185-G1B

TS-185-G1B

TS-185-G1B
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Detailed introduction
Parameters
Feature High Thermal Conductivity
Good Adhesion to bare-Si & metalized
Good tack time

 

 

Storage Condition below -40℃in freezer  
Ag Content 91 wt% Calculatedafter 850 ℃firing
Viscosity 20 Pa.s E-type 3°corn,5rpm @ RT
Thixotropic Index 6 0.5rpm/5rpm
Volume Resistivity 20 x 10-6 Ω･cm Resistivitymeter
DieShear Strength at RT 22 N/mm2 2x2mm Si-die (BSM:Ag) / Ag plated LF
at 260℃ 4.5 N/mm2
Elastic Modulus at RT 11,000 Mpa Measured by DMS
at 260℃ 1,200 MPa
Coefficientof Thermal Expansion α1 30 ppm/℃ Measured by TMA
α2 46 ppm/℃
Tg 75
Thermal Conductivity 45 W/m･K Measured by Laser flush 

 

We could not find any corresponding parameters, please add them to the properties table
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