TR-4846_Shanghai Microhesion Industrial Co., Ltd.

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Adhesive and Bonding material

TR-4846

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Adhesive and Bonding material

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Main features
Highly reliable performance with 22wt% palladium content in paste TR-4865
Most useful silver palladium paste with 15wt% palladium content in paste TR-4846
Excellent performance with 13wt% palladium content in paste TR-4940
Excellent performance with llwt% palladium content in paste TR-4835
Applicable for multilayer circuit with 9.5wt% palladium content in paste TR-2637
Applicable for multilayer circuit with 10wt% palladium content in paste TR-2634
Excellent performance with 7wt% palladium content in paste TR-4920
Applicable for multilayer circuit with 7wt% palladium content in paste TR-4920P
Excellent performance with 3wt% palladium content in paste TR-4910
Excellent performance with Iwt% palladium content in paste TR-4919

Typical Fired Properties			TR-4865	TR-4846	TR-4940	TR-4835	TR-2637
Ag/Pd ratio		wt%	70/30	79/21	82/18	85/15	87/13
Recommended Firing Temperature		°C	850
Fired Thickness		pm	11±2
Resistivity		mH/n at 10μm	W35	W25	W21	冬20	冬21
Solder acceptance		%	N90
Solder leach resistance		Cycles	N4	N3		N2
Adhesion strength	Initial	N/2mm口	30			25	35
	150°C 1000H		15		20	10	25
Viscosity		Pa*s	35OL35	270±25	225±25	230±25	225±25
Thinner			TMS-2

Typical Fired Properties			TR-2634	TR-4920	TR-4920P	TR-4910	TR-4919
AgZPd ratio		wt%	87/13	91	/9	Apr-96	98.7/1.3
Recommended Firing Temperature		°C	850
Fired Thickness		pm	11±2			9±2
Resistivity		mfl/n at 10μm	冬19	W14		冬7
Solder acceptance		%	N90
Solder leach resistance		Cycles	圣	N2
Adhesion strength	Initial	N/2mm口	35	30		50	35
	150°C 1000H		25	20	一	20	10
Viscosity		Pa*s	225±25				325±25
Thinner			TMS-2