Ablebond 84-1LMISR4_Shanghai Weilian Industrial Co., Ltd.

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Ablebond 84-1LMISR4

ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput,automated die attach equipment. The rheology of ABLEBOND® 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems.The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.

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PRODUCTDESCRIPTION

ABLEBOND® 84-1LMISR4 provides the following product.

characteristics:

Technology	Epoxy
Appearance	Silver
Cure	Heatcure
pH	6
Product Benefits	• Excellentdispensability,minimaltailingandstringing • Boxovencure
Application	Dieattach

TYPICAL PROPERTIES OF UNCURED MATERIAL

ThixotropicIndex(0.5/5 rpm)	5.6
Viscosity,BrookfieldCP51,25°C, mPa·s(cP):
Speed5rpm	8000
MoistureAbsorption,wt.%	0.6
@85°C/85RH
FlashPoint-SeeMSDS

TYPICALCURINGPERFORMANCE

Cure Schedule
1 hour @ 175°C
Alternative Curing Conditions
3 to 5°C min ramp to 175°C plus 1 hour @ 175 °C
The ramp was observed to yield reduced bondline voiding and increased strength

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL

PhysicalProperties:
CoefficientofThermalExpansion ISO11359-2
ppm/°C:
BelowTg,ppm/°C	40
AboveTg,ppm/°C	150
GlassTransitionTemperature (Tg) by TMA,°C	120
CoefficientofThermalConductivity, ISO8302,W/(m·K)	2.5
TensileModulus,ISO6721-5,DMTA:
@-65°C	N/mm² 4,414 (psi) (640,000)
@25°C	N/mm² 3,931 (psi) (570,000)
@150°C	N/mm² 2,000 (psi) (290,000)
@250°C	N/mm² 303 (psi) (44,000)
ExtractableIonicContent,@100°C ppm:
Chloride(Cl-)	＜20
Sodium(Na+)	＜10
Potassium(K+)	＜10
ElectricalProperties:
VolumeResistivity,IEC60093,Ω·cm	0.0001

TYPICALPERFORMANCEOFCUREDMATERIAL

DieShearStrength:
2X2mm,Sidieon Ag/Culeadframe,kg-f	19
@25°C
DieShearStrengthvsTemperature,kg-f:
3X3mm,Sidie, kg-f,

Substrate	@25°C	@200°C	@250°C
Ag/CuLF	21kg-f	2.9kg-f	1.7kg-f
BareCuLF	11kg-f	2.6kg-f	1.4kg-f
Pd/Ni/CuLF	27kg-f	2.4kg-f	2.0kg-f

DieShearStrengthafter85°C/85%RHexposurefor168 hours:

3X3mm,Sidie, kg-f,

Substrate	@25°C	@200°C
Ag/CuLF	12kg-f	1.8kg-f
BareCuLF	10kg-f	2.5kg-f
Pd/Ni/CuLF	23kg-f	1.8kg-f

GENERALINFORMATION

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be used with chlorine or other strong oxidizing materials.

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

THAWING:
1.Allow container to reach room temperature before use.
2.After removing from the freezer, set the syringes to stand vertically while thawing.
Refer to the Syringe Thaw time chart for the thaw time recommendation.