Ablebond 84-1LMISR4
PRODUCTDESCRIPTION
ABLEBOND® 84-1LMISR4 provides the following product.
characteristics:
Technology | Epoxy |
Appearance | Silver |
Cure | Heatcure |
pH | 6 |
Product Benefits |
• Excellentdispensability,minimaltailingandstringing • Boxovencure |
Application | Dieattach |
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput,automated die attach equipment. The rheology of ABLEBOND® 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems.The unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
TYPICAL PROPERTIES OF UNCURED MATERIAL
ThixotropicIndex(0.5/5 rpm) | 5.6 |
Viscosity,BrookfieldCP51,25°C, mPa·s(cP): | |
Speed5rpm | 8000 |
MoistureAbsorption,wt.% | 0.6 |
@85°C/85RH | |
FlashPoint-SeeMSDS |
TYPICALCURINGPERFORMANCE
Cure Schedule
1 hour @ 175°C
Alternative Curing Conditions
3 to 5°C min ramp to 175°C plus 1 hour @ 175 °C
The ramp was observed to yield reduced bondline voiding and increased strength
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
PhysicalProperties: | |
CoefficientofThermalExpansion ISO11359-2 | |
ppm/°C: | |
BelowTg,ppm/°C | 40 |
AboveTg,ppm/°C | 150 |
GlassTransitionTemperature (Tg) by TMA,°C | 120 |
CoefficientofThermalConductivity, ISO8302,W/(m·K) | 2.5 |
TensileModulus,ISO6721-5,DMTA: | |
@-65°C | N/mm² 4,414 (psi) (640,000) |
@25°C | N/mm² 3,931 (psi) (570,000) |
@150°C | N/mm² 2,000 (psi) (290,000) |
@250°C | N/mm² 303 (psi) (44,000) |
ExtractableIonicContent,@100°C ppm: | |
Chloride(Cl-) | <20 |
Sodium(Na+) | <10 |
Potassium(K+) | <10 |
ElectricalProperties: | |
VolumeResistivity,IEC60093,Ω·cm | 0.0001 |
TYPICALPERFORMANCEOFCUREDMATERIAL
DieShearStrength: | |
2X2mm,Sidieon Ag/Culeadframe,kg-f | 19 |
@25°C | |
DieShearStrengthvsTemperature,kg-f: | |
3X3mm,Sidie, kg-f, |
Substrate | @25°C | @200°C | @250°C |
Ag/CuLF | 21kg-f | 2.9kg-f | 1.7kg-f |
BareCuLF | 11kg-f | 2.6kg-f | 1.4kg-f |
Pd/Ni/CuLF | 27kg-f | 2.4kg-f | 2.0kg-f |
DieShearStrengthafter85°C/85%RHexposurefor168 hours:
3X3mm,Sidie, kg-f,
Substrate | @25°C | @200°C |
Ag/CuLF | 12kg-f | 1.8kg-f |
BareCuLF | 10kg-f | 2.5kg-f |
Pd/Ni/CuLF | 23kg-f | 1.8kg-f |
GENERALINFORMATION
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be used with chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
THAWING:
1.Allow container to reach room temperature before use.
2.After removing from the freezer, set the syringes to stand vertically while thawing.
Refer to the Syringe Thaw time chart for the thaw time recommendation.
Learn more about products

Follow us
Copyright 2021. Shanghai Weilian Industrial Co., Ltd. 沪ICP备2021026885号
Power By:www.300.cn Shanghai
- whatapp
- Contact Us
- Back to top