KESP180-Series

RESP240-Series is based on thermosetting epoxy mixed with solder powder that shows
higher reliability performance than conventional solder paste
Application
•   Soldering material for Flip chip and SMT in semiconductor process
•   It is applicable to pin transfer, dispensing and screen printing process
Features
•   Consistent process performance without property change in successive work
•   Excellent heat resistance at high temperature reflow
•   Excellent wetting performance and minimizing voids
•   Effect on insulation resistance due to epoxy protection
•   Effective for fine pitch due to hot slump resistance
•   Better joint strength than normal solder paste
•   Less satellite ball issue after reflow
Information
Alloy  : Sn3.0Ag0.5Cu
Particle Size  : T9 (1~5um), T8 (1~8um) T7 (2~11um), T6 (5~15um)
T5 (10~25um), T4 (20~38um), T3 (25~45um)
Packing size  : 200g(Jar) - customized packing available
Properties

*. Viscosity  can be adjustable per customer’s process condition

How to use
1)  Thawing
Allow container to reach room temperature before use(3 hours ago) without opening
Opening in frozen condition may cause generation of satellite balls due to condensation
Open and use after the paste reaches the room temperature(20~25℃)
2)  Mixing

Manual mixing (1min ~ 2min)
Excessive mixing can make the property change

Reflow Profile
•  Recommended Reflow condition (reflow process)