Polishing materials
HJ-UFE 0603 underfill
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Product serial number
Category
Solder materials
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Detailed introduction
Parameters
UFE Under-fill Epoxy
0603 Material Number
HJ-UFE 0603 is reworkable underfill epoxy that protect solder joint during drop test and thermal cycling test.
Application
• 2nd under-fill process for chip scale package & ball grid array
• Thermal setting epoxy material by curing process.
Features
• Using one liquid type material
• Fast curing material
• Excellent reliability of solder joint and good bond ability with substrate
Properties
| Spec. | Unit | Value | Measured |
| Color | - | Black | Brookfield DV-II spindle #6 (25℃) |
| Viscosity at 25oC | cPs | 2,400±400 | DSC |
| Tg | ℃ | 70 | 22℃ |
| Pot life | days |
5 |
Below 10℃ |
| Shelf life | months | 6 | Laser Flash Diffusivity |
| Cure condition | ℃ | 10min.@120℃ | Oven |
| Moisture absorption | % | 0.1 | 24hrs@25℃ |
Packing Information
• Packing shape : syringe type and customized packing available
Storage
• Keep the materials in a below -20℃ refrigerator
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