MH-781
HJ-UFE 0907
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Product serial number
Category
Welding materials
Quantity
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Stock:
0
Detailed introduction
Parameters
UFE Under-fill Epoxy
0907 Material Number
HJ-UFE 0907 is reworkable underfill epoxy that protect solder joint during drop test and thermal cycling test.
Application
• Under-fill process for chip scale package, ball grid array and SSD module
• Thermal setting epoxy material by curing process.
Features
• Using one liquid type material
• Fast curing material
• Excellent reliability of solder joint and good bond ability with substrate
Properties
| Spec. | Unit | Value | Measured |
| Color | - | Black | Brookfield DV-II spindle #6 (25℃) |
| Viscosity at 25℃ | cPs | 350±50 | DSC |
| Tg | ℃ | 100 | 25℃ |
| Pot life | days |
3 |
Below 20℃ |
| Shelf life | months | 6 | Laser Flash Diffusivity |
| Cure condition | ℃ | 10min.@130℃ | Oven |
Packing Information
• Packing shape : syringe type and customized packing available
Storage
• Keep the materials in a below -20℃ refrigerator
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HJ-UFE 0603
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RESP290-Series
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