search
Bonding material Welding materials Potting material
搜索
Product Center
Product Center
Homepage
/
Product Center
/
Thermal conductive material
/
陶瓷和金属腔体材料

陶瓷和金属腔体材料

陶瓷和金属腔体材料
Retail price
0.0
元
Market price
0.0
元
Number of views:
1000
Product serial number
Category
Thermal conductive material
Quantity
-
+
Stock:
0
1
0
Detailed introduction
Parameters

We could not find any corresponding parameters, please add them to the properties table
Previous
None
Next
AlSiC Hermetic Packaging

Learn more about products

MH-781
MH-781
MH-781®是一种为解决激光工艺中高温产生的挂渣问题而研发的新型出渣材料，使用非常方便，在加工件的背面均匀涂覆晾干后可加工，加工完毕后以清水冲洗，就可以得到平整的加工断面。
微晶铝合金RSA905和443特性
微晶铝合金RSA905和443特性
微晶铝合金RSA905和443特性
RSA905
RSA905
RSA905
陶瓷和金属腔体材料
陶瓷和金属腔体材料
陶瓷和金属腔体材料
AlSiC Hermetic Packaging
AlSiC Hermetic Packaging
AlSiC Hermetic Packaging
Aluminum nitride ceramic circuit board
Aluminum nitride ceramic circuit board
The introduction of product our product adopts the international advance technology of powder metallurgy. It bonds the highly conductive silver- copper alloy directly on the ceramic which contains the ALN. This product is a standard component be used widely in the electrical thick film circuit. Micro semiconductor cooler electrical power control circuit electric power semiconductor module, solid relay, electronic heating equipment, microwave circuit and car electron military aviation and the space technology.
EG-9377 电路板级灌封胶
EG-9377 电路板级灌封胶
EG-9377 电路板级灌封胶
HJ-UFE 0603
HJ-UFE 0603
HJ-UFE 0603
HJ-UFE 0907
HJ-UFE 0907
HJ-UFE 0907
RESP290-Series
RESP290-Series
RESP290-Series is based on thermosetting epoxy mixed with solder powder that shows higher reliability performance than conventional solder paste

Copyright 2021. Shanghai Weilian Industrial Co., Ltd.  沪ICP备2021026885号