MH-781
Aluminum nitride ceramic circuit board
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Thermal conductive material
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Detailed introduction
Parameters
The introduction of product our product adopts the international advance technology of powder metallurgy. It bonds the highly conductive silver- copper alloy directly on the ceramic which contains the ALN. This product is a standard component be used widely in the electrical thick film circuit.
Micro semiconductor cooler electrical power control circuit electric power semiconductor module, solid relay, electronic heating equipment, microwave circuit and car electron military aviation and the space technology.
The basic parameters
| 1 | The welding layer with highly combination of silver-copper and Ceramic could directly permeate through the ceramic bad. | ≥6N / mm² |
| 2 | The product can bear the harsh shock of temperature and adapt to the hasty encounter | —200℃—600 ℃ |
| 3 | Thermal conductivity | ≥170 W/m.K |
| 4 | Service life | 高，可靠 |
| 5 | The cycling times of heating load | >10000次 |
| 6 | Solderability and solder-resisting | 良好 |
| 7 | Line definition | 0.2 mm |
| 8 | Thickness of ceramic substrate | ≥0.20 mm |
| 9 | Thickness of joining alloy to silver-copper | 0.02—0.15mm |
Others
1、It can do various kind of plating material such like nickel, tin, copper, gold-plating.
2、It can do the flow soldering and the uniform thickness flow soldering.
3、We can develop other relative products according to the customs requests.
The introduction of product our product adopts the international advance technology of powder metallurgy. It bonds the highly conductive silver- copper alloy directly on the ceramic which contains the 96 AL2O3. This product is a standard component be used widely in the electrical thick film circuit.
Micro semiconductor cooler electrical power control circuit electric power semiconductor module, solid relay, electronic heating equipment, microwave circuit and car electron military aviation and the space technology.
The basic parameters
| 1 | The welding layer with highly combination of silver-copper and Ceramic could directly permeate through the ceramic bad. | ≥8N / mm² |
| 2 | The product can bear the harsh shock of temperature and adapt to the hasty encounter | —50℃—400 ℃ |
| 3 | Corrosion-resisting | 良好 |
| 4 | Service life | 高，可靠 |
| 5 | The cycling times of heating load | >10000次 |
| 6 | Solderability and solder-resisting | 良好 |
| 7 | Line definition | 0.2 mm |
| 8 | Thickness of ceramic substrate | ≥0.25 mm |
| 9 | Thickness of joining alloy to silver-copper | 0.02—0.15mm |
Others
1、It can do various kind of plating material such like nickel, tin, copper, gold-plating.
2、It can do the flow soldering and the uniform thickness flow soldering.
3、We can develop other relative products according to the customs requests.
It used the most advanced bond copper technology of the world. It bonds highly conductive copper foils directly to alumina ceramic substrates which contains 96 AL2O3.It is in the main to setting up the thermoelectric cooler that is upgraded product used by Mo-Mn second bond copper of many manufacturer at present.
The basic parameters
| 1 | The welding layer with highly combination of silver-copper and Ceramic could directly permeate through the ceramic bad. | ≥20N / mm² |
| 2 | The product can bear the harsh shock of temperature and adapt to the hasty encounter | —50℃—400 ℃ |
| 3 | Corrosion-resisting | 良好 |
| 4 | Service life | 高，可靠 |
| 5 | The cycling times of heating load | >10000次 |
| 6 | Solderability and solder-resisting | 良好 |
| 7 | Line definition | 0.2 mm |
| 8 | Thickness of ceramic substrate | ≥0.4 mm |
| 9 | Thickness of joining alloy to silver-copper | 0.02—0.15mm |
Others
1、It can do various kind of plating material such like nickel, tin, copper, gold-plating.
2、It can do the flow soldering and the uniform thickness flow soldering.
3、We can develop other relative products according to the customs requests.
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