MH-781®是一种为解决激光工艺中高温产生的挂渣问题而研发的新型出渣材料，使用非常方便，在加工件的背面均匀涂覆晾干后可加工，加工完毕后以清水冲洗，就可以得到平整的加工断面。

微晶铝合金RSA905和443特性

RSA905

陶瓷和金属腔体材料

AlSiC Hermetic Packaging

The introduction of product our product adopts the international advance technology of powder metallurgy. It bonds the highly conductive silver- copper alloy directly on the ceramic which contains the ALN. This product is a standard component be used widely in the electrical thick film circuit. Micro semiconductor cooler electrical power control circuit electric power semiconductor module, solid relay, electronic heating equipment, microwave circuit and car electron military aviation and the space technology.

EG-9377 电路板级灌封胶

HJ-UFE 0603

HJ-UFE 0907

RESP290-Series is based on thermosetting epoxy mixed with solder powder that shows higher reliability performance than conventional solder paste

RESP240-Series is based on thermosetting epoxy mixed with solder powder that shows higher reliability performance than conventional solder paste

REFP240