Epoxy Flux-REFP240

REFP240  is  based  on  thermosetting  resin  that  shows  higher  reliability
performance than conventional flux

Application

•  This fluxing material is specialized in the dispensing process.
•  Available for fluxing material for ball mount, flip chip package, package on package(PoP)

Features

•  This fluxing material has no residue after reflow.
•  The key performance is no cleaning process

* cP = mPa·s = (1/1000)Pa·s 

Packing size : Syringe (10cc, 30cc), Jars(100gram),customized packing available

Reflow Profile
•  Recommended Reflow condition (reflow process)

How to use
•    Allow to reach room temperature before use              
This will prevent moisture condensation build up in theepoxyflux
•    For that time, it is recommended around 60minutes (1hour)
Storage
•    Should be stored at -40℃ or colder