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HJ-UFE 0907 underfill

HJ-UFE 0907
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Detailed introduction
Parameters

UFE    Under-fill Epoxy    
0907    Material Number
HJ-UFE 0907 is reworkable underfill epoxy that protect solder joint during drop test and thermal cycling test.
Application
•  Under-fill process for chip scale package, ball grid array and SSD module
•  Thermal setting epoxy material by curing  process.
Features
•  Using one liquid type material
•  Fast curing material
•  Excellent reliability of solder joint and good bond ability with substrate
Properties

Spec. Unit Value Measured
Color - Black Brookfield DV-II spindle #6 (25℃)
Viscosity at 25℃ cPs 350±50 DSC
Tg 100 25℃
Pot life days

3

Below 20℃
Shelf life months 6 Laser Flash Diffusivity
Cure condition 10min.@130℃ Oven

 

Packing Information
•    Packing shape : syringe type and customized packing available
Storage
•    Keep the materials in a below -20℃ refrigerator

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